Lenovo reveals the innovative manufacturing process of personal computers
Lenovo (HKSE: 992) (ADR: LNVGY), the world leader in the segment of personal computers, has announced the launch of a new patented process of low temperature soldering (Low Temperature Solder LTS), designed to improve the production of personal computers by saving energy and increasing reliability.
Since then, more than 10 years ago had to abandon the use of lead solder due to environmental problems, the electronic industry was looking for a solution to reduce heat, energy consumption and carbon emissions, improving the soldering process based on tin, which replaced the old process with the use of lead. Process based on tin require very high temperatures, consuming more energy and puts additional stress components. However, thanks to a new process of low temperature soldering, Lenovo proves that it continues to remain at the forefront of innovation, introducing a fundamentally new process. It should be noted that this applies not only to the products of Lenovo, but can universally be applied to the production of electronics using printed circuit boards without any additional cost or effect on characteristics for consumers.
True innovation lies in the scientific development and testing necessary for the improvement and implementation of new process of low temperature soldering. Lenovo explored thousands of combinations of ingredients of the solder paste consisting of a mixture of tin, copper, Nickel and silver, bismuth, particular compositions of material flux and a unique profile of time and temperature of heating, which are combined to place this process. Usually, the standard electronics Assembly using surface mount technology (surface mount technology, SMT), solder and flux initially printed on the front side of the PCB. Then, you add components and apply heat to melt the solder mixture, fastening and connecting components with a cost. In the new process the soldering takes place at a maximum temperature of 180 degrees Celsius which is 70 degrees lower compared to the previous method. Throughout the testing and review of Lenovo use the existing materials for the preparation of soldering paste and existing equipment for heating, so Lenovo may introduce a new system without increasing production costs.
After the verification procedure, Lenovo found a significant reduction of carbon emissions resulting from the use of the new process. This procedure has been applied for the production of the series ThinkPad E and fifth generation X1 Carbon. For 2017, Lenovo plans to introduce a new process of low temperature soldering for 8 Assembly lines that, according to preliminary estimates, should reduce carbon emissions by 35% 1. By the end of 2018 Lenovo plans to have 33 lines, 2 furnaces on line, using the new process, allowing an annual emission reduction 5956 metric tons of CO22. To estimate the size of this change, one can imagine that such CO2 emissions equivalent to the consumption of more than 2.5 million liters of gasoline in 3.
Thanks to the new process, Lenovo also expects to achieve greater reliability of their devices for reducing heat stress during the procedure of “baking”. In the early stages of the introduction of Lenovo there was a decrease in warpage of printed circuit boards by 50% and reducing the number of defective parts in the production process.
Lenovo continues to demonstrate its leadership in innovation, technology and sustainable development. The transition to a low carbon economy once again confirmed by the reduction of emissions resulting from the use of new process of low temperature soldering. In addition, in 2018 free Lenovo intends to offer a new procedure for use throughout the industry.